JPS6240438Y2 - - Google Patents

Info

Publication number
JPS6240438Y2
JPS6240438Y2 JP1980089390U JP8939080U JPS6240438Y2 JP S6240438 Y2 JPS6240438 Y2 JP S6240438Y2 JP 1980089390 U JP1980089390 U JP 1980089390U JP 8939080 U JP8939080 U JP 8939080U JP S6240438 Y2 JPS6240438 Y2 JP S6240438Y2
Authority
JP
Japan
Prior art keywords
mic
board
ground electrode
heat sink
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980089390U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5714466U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980089390U priority Critical patent/JPS6240438Y2/ja
Publication of JPS5714466U publication Critical patent/JPS5714466U/ja
Application granted granted Critical
Publication of JPS6240438Y2 publication Critical patent/JPS6240438Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Structure Of Printed Boards (AREA)
  • Amplifiers (AREA)
JP1980089390U 1980-06-27 1980-06-27 Expired JPS6240438Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980089390U JPS6240438Y2 (en]) 1980-06-27 1980-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980089390U JPS6240438Y2 (en]) 1980-06-27 1980-06-27

Publications (2)

Publication Number Publication Date
JPS5714466U JPS5714466U (en]) 1982-01-25
JPS6240438Y2 true JPS6240438Y2 (en]) 1987-10-16

Family

ID=29451419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980089390U Expired JPS6240438Y2 (en]) 1980-06-27 1980-06-27

Country Status (1)

Country Link
JP (1) JPS6240438Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584606A (en) 1983-09-01 1986-04-22 Olympus Optical Co., Ltd. Image pickup means
JPH0629911B2 (ja) * 1985-05-07 1994-04-20 旭光学工業株式会社 内視鏡の先端部構造

Also Published As

Publication number Publication date
JPS5714466U (en]) 1982-01-25

Similar Documents

Publication Publication Date Title
US5075759A (en) Surface mounting semiconductor device and method
JP3051011B2 (ja) パワ−モジュ−ル
US6455925B1 (en) Power transistor package with integrated flange for surface mount heat removal
US4167031A (en) Heat dissipating assembly for semiconductor devices
US3982271A (en) Heat spreader and low parasitic transistor mounting
US4314270A (en) Hybrid thick film integrated circuit heat dissipating and grounding assembly
US5889319A (en) RF power package with a dual ground
JPH09116091A (ja) 混成集積回路装置
JPS6240438Y2 (en])
US5751555A (en) Electronic component having reduced capacitance
JPH0563454A (ja) 半導体装置
JPH0595212A (ja) 高周波半導体混成集積回路装置
JP3396541B2 (ja) 混成集積回路装置を搭載した回路基板
JPH09213730A (ja) 高周波用モジュール基板およびそれを用いた高周波電力増幅モジュール
JP2662738B2 (ja) セラミックス放熱フィン付半導体装置
JP2501950B2 (ja) 半導体装置
JPS62269349A (ja) 半導体装置
JP2798334B2 (ja) 半導体装置
JPS5929377Y2 (ja) 高周波高出力トランジスタ装置
JPS5840339B2 (ja) 高周波トランジスタ
JPH0746007A (ja) 電力用基板および高周波用電力増幅器
JPS6315430A (ja) 半導体装置の製造方法
JPH0115144B2 (en])
JPS5844636Y2 (ja) 混成集積回路装置
JPH02140969A (ja) 半導体集積回路装置